WE HAVE PLEASURE TO INVITE TO THE CONFERENCE
‘MICROTECHNOLOGY AND THERMAL PROBLEMS IN ELECTRONICS’
June 23th – June 25th 2025, Lodz, POLAND
| The Conference is organised by: DEPARTMENT OF SEMICONDUCTOR AND OPTOELECTRONIC DEVICES, LODZ UNIVERSITY OF TECHNOLOGY, POLAND with the cooperation of: INSTITUTE OF MICROELECTRONICS AND OPTOELECTRONICS, WARSAW UNIVERSITY OF TECHNOLOGY, POLAND and INSTITUTE OF MATERIALS SCIENCE AND ENGINEERING LODZ UNIVERSITY OF TECHNOLOGY, POLAND Scope MicroTherm is an International Conference on Microtechnology and Thermal Problems in Electronics being organised as a cyclic event. The success of the first seminar in 1996, that was devoted mainly to thermal management aspects, and the successive conferences have led us to the thirteenth edition. Since the first meeting, the scope of the Conference has expanded, following the electronics progress. Now, it covers the subjects connected with extreme temperature electronics, sensors and measurement techniques, modelling, simulation, wide band-gap materials, packaging and reliability, renewable energy sources and photonics with special emphasis on microelectronic technologies. Programme The programme of the Conference is conformed to its basic task, i.e. to create the opportunity to present the achievements in the field of thermal management and microtechnology. Apart from the general sessions covering the main Conference topics, we consider a special one – Students’ Session – dedicated to students and young researchers. We hope that in such a way the young promising candidates for researchers will have an opportunity to present their first ideas and results. According to the habits of previous conferences the main criterion here is the authors’ age. Contact to us: The Organising Committee MicroTherm 2019 Lodz University of Technology Department of Semiconductor and Optoelectronic Devices 211/215 Wolczanska Street, 90-924 Lodz, POLAND Phone: (+4842) 6312647 Fax: (+4842) 6313952 http://microtherm.semtherm.eu | Main Topics The main topics of the Conference are: A optimizing designs of semiconductor devices, integrated and hybrid circuits, and electronic equipment, B reliability and thermal management of electronic elements, devices and systems, C investigation and measurements of semiconductor devices, materials and electronic systems, D extreme temperature electronics (materials, devices and circuits), E processes of microelectronics technology and packaging of electronics elements, F wide-band gap materials, G renewable energy solutions (especially dedicated for photovoltaics and power harvesting), H photonic and optoelectronic devices and systems, integrated microsystems, I nano-sheets, J biomedical engineering. Conference Publications Traditionally, the two forms of publications are considered. The Conference Proceedings are going to be published as a book of extended abstracts and distributed at the Conference. Next, the extended papers, after additional review process, are going to be submitted to different journals. Till now, the post-conference materials has been published in special issues of Materials Science and Engineering B, Journal of Physics: Conference Series and as regular papers in Microelectronics Engineering. .png) | |
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